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Máy Cắt Laser Phi Kim Loại, S035-50 |
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Giá: | Chưa được cập nhật |
Thông tin tồn kho: | Hàng có sẵn |
Lượt mua: | Đang cập nhật |
Lượt xem: | 5.135 |
- S035-50 laser scribing machine adopts Nd:YAG laser oscillator
- Cross worktable, dual workstation vacuum acetabula and Han's self developed control software
- S035-50 is the most popular and practical machine model in solar silicon slicing market
ứng dụng:
S035-50 laser scribing machine is widely used in the slicing of monocrystalline silicon, polycrystalline silicon solar battery and silicon wafer in solar industry; and in the cutting of fragile items, some soft metal and non-metal sheetModel | S035-50 |
Laser type | YAG |
Laser wavelength | 1064nm |
Max. laser power | 50W |
Beam quality M2 | ≤10 |
Max. positionging speed | 150mm/s |
Max. cutting speed | 120mm/s |
Max. cutting depth | 0.8mm |
Min. line width | 0.04mm |
Repetition position accuracy | ≤0.02mm |
Position accuracy | ≤±0.02mm |
Working area | 350×350mm |
Power consumption | 5kW |
Power supply | 380V/50Hz/20A |
Weight | 455kg |
Dimension(LxWxH, mm) | 1750×1150×720 |